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ECG008
Product Features
x DC - 4 GHz x +24 dBm P1dB at 1 GHz x +40 dBm OIP3 at 1 GHz x 15 dB Gain at 1 GHz
The Communications Edge TM Product Information
InGaP HBT Gain Block
Product Description
The ECG008 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the ECG008 typically provides 15 dB of gain, +40 dBm Output IP3, and +24 dBm P1dB. The ECG008 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a low cost, surface-mountable SOT-89 package. The ECG008 is also available in a lead-free/green/RoHS-compliant SOT89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG008 will work for other various applications within the DC to 4 GHz frequency range such as CATV and fixed wireless.
Functional Diagram
GND 4
x 4.6 dB Noise Figure at 2 GHz x SOT-89 and lead-free / green SOT-89 Package Styles x Internally matched to 50 :
1 RF IN
2 GND
3 RF OUT
ECG008B / ECG008B-G
Applications
x x x x x x Mobile Infrastructure CATV / DBS W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (3)
Typical Performance (3)
Units
MHz MHz dB dBm dBm dB MHz dB dB dB dBm dBm dB V mA VSWR
Min
DC
Typ
1000 15 +24 +40 4.6 2000 14.3 25 14 +23 +37 4.8 7.3 120 10:1
Max
4000
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 14.7 -26 -19.4 +24.3 +41 4.7
Typical
900 14.6 -28.5 -17.4 +24 +40 4.6 1900 14.3 -28 -13.4 +23.3 +37 4.7

Noise Figure
Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Output mismatch w/o spurs
2140 14.3 -19.5 -15 +19.0 +30.5 4.8
System.
13
3. Test conditions: T = 25 C, Supply Voltage = +9 V, Device Voltage = +7.3V, Rbias = 14 , 50
+34 6.8
7.8
1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +9 V, Rbias = 14 , 50 System. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Current Junction Temperature -40 to +85 qC -65 to +150 qC +15 dBm 160 mA +250 qC
Rating
Ordering Information
Part No.
ECG008B ECG008B-G ECG008B-PCB
Description
(leaded SOT-89 Pkg)
InGaP HBT Gain Block InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
700 -2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
ECG008
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure
The Communications Edge TM Product Information
InGaP HBT Gain Block
Supply Bias = +9 V, Rbias = 14 :, Icc = 120 mA
MHz dB dB dB dBm dBm dB 100 14.8 -25 -20 +24.5 +41.6 4.9 500 14.7 -26 -19 +24.3 +41 4.7
Typical Device RF Performance
900 14.6 -28.5 -17 +24 +40 4.6 1900 14.3 -28 -13 +23.2 +37 4.7
2140 14.3 -25 -13 +22.8 +36 4.9
2400 14.2 -23.2 -12 +21.8 +34 5.2
3500 14.5 -15.4 -7.9 +17.3
5800 12.4 -6 -2.7
1. Test conditions: T = 25 C, Supply Voltage = +9 V, Device Voltage = 7.3 V, Rbias = 14 , Icc = 120 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.
Gain vs. Frequency 20 18 S11, S22 (dB) Gain (dB) 16 14 12 10 500 +25 C 1000 -40 C +85 C 2500 3000 0 -5 -10 -15 -20 -25 -30 -35 -40 0 1
S11, S22 vs. Frequency 140 S22 S11 120 100 Icc (mA) 80 60 40 20 2 3 4 Frequency (GHz) 5 6 0 0.0 2.0 +25 C
Vde vs. Icc
1500 2000 Frequency (MHz) OIP3 vs. Frequency
4.0 6.0 Vde (V) P1dB vs. Frequency
8.0
10.0
Noise Figure vs. Frequency 5 4.5 NF (dB) 4 3.5 3 2.5 3000 2 500
1000 1500 2000
45 Ouput IP3 (dBm) 40 35 30 +25 C 25 500 1000 -40 C +85 C 2500
30 25 20 15 +25 C 10 500 1000 1500 -40 C 2000 +85 C 2500 3000
1500 2000 Frequency (MHz)
Frequency (MHz)
P1dB (dBm)
Frequency (MHz)
S-Parameters (Vdevice = +7.3 V, ICC = 120 mA, T = 25 C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-24.87 -26.14 -28.46 -30.86 -28.14 -23.15 -18.78 -15.39 -12.91 -10.59 -8.44 -6.76 -5.43
176.05 167.68 166.94 -178.22 -144.76 -137.68 -150.37 -171.26 161.38 132.87 105.27 80.71 61.63
14.88 14.71 14.60 14.39 14.30 14.20 14.30 14.48 14.65 14.51 14.04 13.17 12.10
177.77 161.26 142.99 125.46 108.38 91.08 74.41 56.29 35.57 13.60 -8.75 -31.25 -50.89
-18.94 -18.94 -19.02 -18.94 -18.86 -18.64 -18.20 -17.52 -16.85 -16.36 -16.20 -16.26 -16.59
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
S12 (ang)
S22 (dB)
S22 (ang)
-1.51 -5.99 -11.44 -16.56 -21.00 -25.54 -29.98 -36.74 -45.50 -56.53 -68.74 -81.52 -93.75
-20.41 -19.43 -17.47 -15.40 -13.40 -11.63 -9.65 -7.83 -6.06 -4.68 -3.62 -2.87 -2.41
-4.20 -39.76 -72.27 -95.62 -116.18 -133.34 -151.20 -171.17 165.56 141.33 117.07 94.30 73.89
December 2004
ECG008
The Communications Edge TM Product Information
InGaP HBT Gain Block
Recommended Application Circuit
Vcc Icc = 120 mA
R4 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke ECG008B C1 Blocking Capacitor R2 18
R2 RF OUT R3 4.7
R3
RF IN
C2 Blocking Capacitor
Reference Designator L1 C1, C2, C4
50 820 nH .018 F
Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF
Recommended Bias Resistor Values 2500 18 nH 56 pF 3500 15 nH 39 pF
Supply Voltage 9V 10 V 12 V R1 value 14 ohms 23 ohms 39 ohms Size 2010 2512 2512
1. The proper values for the components are dependent upon the intended frequency of operation. 2. The component values in the table below are contained on the evaluation board to achieve optimal broadband performance. 3. R2 and R3 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz.
The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +9 V. A 1% tolerance resistor is recommended.
Ref. Desig. L1 C1, C2 C3 C4 R2 R3 R4
Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 PF chip capacitor Do Not Place 18 : chip resistor 4.7 : chip resistor 14 : 1% tolerance
Size 0603 0603 0603 0603 0603 2010
(WJ's evaluation board uses the circuit shown above.)
14 12 10 8 6 4 Gain
ECG008B-PCB Performance Data
0
S11 Return Loss S22
-10
-20
-30
0
1
2 Frequency (GHz)
3
4
0
1
2 Frequency (GHz)
3
4
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
ECG008
The Communications Edge TM Product Information
InGaP HBT Gain Block
ECG008B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an "E008" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes Land Pattern
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
ECG008
The Communications Edge TM Product Information
InGaP HBT Gain Block
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
ECG008B-G (Green / Lead-free SOT-89 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an " E008G" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the " Application Notes" section.
MSL / ESD Rating
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004

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